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Heinz Zeller

Principal, Sustainability
Hugo Boss

Heinz initially worked in chemical research, first on anti-malaria and later on biodegradable polymers. Moved on to project management and completed a Bachelor of Science in Information Systems.

He joined HUGO BOSS Ticino, South Switzerland, in 1998 with the responsibility to insource all existing textile and leather licensees, taking over the responsibility of logistics and participated at various corporate business-reengineering projects.

Heinz Zeller

Principal, Sustainability
Hugo Boss

Heinz Zeller

Principal, Sustainability
Hugo Boss

Heinz initially worked in chemical research, first on anti-malaria and later on biodegradable polymers. Moved on to project management and completed a Bachelor of Science in Information Systems.

He joined HUGO BOSS Ticino, South Switzerland, in 1998 with the responsibility to insource all existing textile and leather licensees, taking over the responsibility of logistics and participated at various corporate business-reengineering projects.

After the completion of the Cert. Adv. Study (CAS) in CSR, he established the HUGO BOSS sustainability road map and the sustainability strategy. Based on this, the required structures and programs were implemented, and he led the various involved departments to publish the first sustainability report in 2013. The results of this work are many recognitions like CDP DACH sector leader, robecosam industry mover or the listing in the Dow Jones Sustainability Index 2017.

Moreover, he created important public documents like the three whitepapers on Natural Capital Valuation or policies for the environment, plant based materials, animal welfare, responsible products and more with the help of some well-known cotton and fiber experts as well other field experts

Join this moderated roundtable discussion group of 10-20 attendees focusing on efficient edge ML inference.

There will be several moderators per topic area to allow for multiple tables and questions will be prepared in advance. Each group will be multidisciplinary with representation from across the tech stack. Attendees who have registered for the event will be able to sign up for the roundtable discussion groups closer to the event, or via an AI Hardware & Edge AI Summit sales representative.

The subtopics to be discussed will include:

- Efficient edge-based inference on low-power devices: hardware and software optimizations
- Challenges of handling high-dimensional data at the edge for efficient inference
- Adapting machine learning models for low-power edge devices: balancing model accuracy and computational complexity
- Designing efficient edge-to-cloud communication protocols to minimize latency and optimize bandwidth usage

Join this moderated roundtable discussion group of 10-20 attendees focusing on efficient cloud based ML inference.

There will be several moderators per topic area to allow for multiple tables and questions will be prepared in advance. Each group will be multidisciplinary with representation from across the tech stack. Attendees who have registered for the event will be able to sign up for the roundtable discussion groups closer to the event, or via an AI Hardware & Edge AI Summit sales representative.

The subtopics to be discussed will include:

- Optimizing hardware for efficient inference: balancing cost and performance
- Latency and throughput challenges in cloud-based machine learning inference
- Designing distributed systems for scalable and reliable inference

Join this moderated roundtable discussion group of 10-20 attendees focusing on challenges in deploying machine learning into production.

There will be several moderators per topic area to allow for multiple tables and questions will be prepared in advance. Each group will be multidisciplinary with representation from across the tech stack. Attendees who have registered for the event will be able to sign up for the roundtable discussion groups closer to the event, or via an AI Hardware & Edge AI Summit sales representative.

The subtopics to be discussed will include:

- Mitigating challenges from changes between training and production infrastructure
- MLOps workflows for shortening time-to-value
- Navigating compatability, scalability and availabilty of hardware during deployment

AWC 166.1 Post event Report 2022

Join this moderated roundtable discussion group of 10-20 attendees focusing on novel training and learning paradigms for ML. 

There will be several moderators per topic area to allow for multiple tables and questions will be prepared in advance. Each group will be multidisciplinary with representation from across the tech stack. Attendees who have registered for the event will be able to sign up for the roundtable discussion groups closer to the event, or via an AI Hardware & Edge AI Summit sales representative.

The subtopics to be discussed will include:

- Limitations of current training architectures and paradigms
- Use cases and challenges for distributed learning (i.e. federated learning)
- Data centric AI + few & low shot learning methods for efficient training
- Datasets for ML training - Open Source options

Join this moderated roundtable discussion group of 10-20 attendees focusing on novel training and learning paradigms for ML. 

There will be several moderators per topic area to allow for multiple tables and questions will be prepared in advance. Each group will be multidisciplinary with representation from across the tech stack. Attendees who have registered for the event will be able to sign up for the roundtable discussion groups closer to the event, or via an AI Hardware & Edge AI Summit sales representative.

The subtopics to be discussed will include:

- Limitations of current training architectures and paradigms
- Use cases and challenges for distributed learning (i.e. federated learning)
- Data centric AI + few & low shot learning methods for efficient training
- Datasets for ML training - Open Source options

Author:

Rochan Sankar

Co-Founder & CEO
Enfabrica

Rochan is Founder, President and CEO of Enfabrica. Prior to founding Enfabrica, he was Senior Director and leader of the Data Center Ethernet switch silicon business at Broadcom, where he defined and brought to market multiple generations of Tomahawk/Trident chips and helped build industry-wide ecosystems including 25G Ethernet and disaggregated whitebox networking.

Prior, he held roles in product management, chip architecture, and applications engineering across startup and public semiconductor companies. Rochan holds a B.A.Sc. in Electrical Engineering from the University of Toronto and an MBA from the Wharton School, and has 6 issued patents.

Rochan Sankar

Co-Founder & CEO
Enfabrica

Rochan is Founder, President and CEO of Enfabrica. Prior to founding Enfabrica, he was Senior Director and leader of the Data Center Ethernet switch silicon business at Broadcom, where he defined and brought to market multiple generations of Tomahawk/Trident chips and helped build industry-wide ecosystems including 25G Ethernet and disaggregated whitebox networking.

Prior, he held roles in product management, chip architecture, and applications engineering across startup and public semiconductor companies. Rochan holds a B.A.Sc. in Electrical Engineering from the University of Toronto and an MBA from the Wharton School, and has 6 issued patents.

Moderator

Author:

Mike Demler

Semiconductor Industry Analyst
Independent

Mike Demler is a longtime semiconductor industry veteran, technology analyst and strategic consultant. Over the last 10 years, Mike has authored numerous in-depth analyses of the innovative technologies driving advances in AI, ADAS, and autonomous vehicles. He co-authored five editions of the Linley Group Guide to Processors for Deep Learning, along with the Guide to Processors for Advanced Automotive.  He now offers his insights as an advisor to clients across a broad spectrum of the technology industry.

Mike Demler

Semiconductor Industry Analyst
Independent

Mike Demler is a longtime semiconductor industry veteran, technology analyst and strategic consultant. Over the last 10 years, Mike has authored numerous in-depth analyses of the innovative technologies driving advances in AI, ADAS, and autonomous vehicles. He co-authored five editions of the Linley Group Guide to Processors for Deep Learning, along with the Guide to Processors for Advanced Automotive.  He now offers his insights as an advisor to clients across a broad spectrum of the technology industry.

Panellists

Author:

Gayathri Radhakrishnan

Partner
Hitachi Ventures

Gayathri is currently Partner at Hitachi Ventures. Prior to that, she was with Micron Ventures, actively investing in startups that apply AI to solve critical problems in the areas of Manufacturing, Healthcare and Automotive. She brings over 20 years of multi-disciplinary experience across product management, product marketing, corporate strategy, M&A and venture investments in large Fortune 500 companies such as Dell and Corning and in startups. She has also worked as an early stage investor at Earlybird Venture Capital, a premier European venture capital fund based in Germany. She has a Masters in EE from The Ohio State University and MBA from INSEAD in France. She is also a Kauffman Fellow - Class 16.

Gayathri Radhakrishnan

Partner
Hitachi Ventures

Gayathri is currently Partner at Hitachi Ventures. Prior to that, she was with Micron Ventures, actively investing in startups that apply AI to solve critical problems in the areas of Manufacturing, Healthcare and Automotive. She brings over 20 years of multi-disciplinary experience across product management, product marketing, corporate strategy, M&A and venture investments in large Fortune 500 companies such as Dell and Corning and in startups. She has also worked as an early stage investor at Earlybird Venture Capital, a premier European venture capital fund based in Germany. She has a Masters in EE from The Ohio State University and MBA from INSEAD in France. She is also a Kauffman Fellow - Class 16.

Author:

Sakyasingha Dasgupta

Founder & CEO
EdgeCortix

Sakya is the founder and Chief Executive officer of EdgeCortix. He is an artificial intelligence (AI) and machine learning technologist, entrepreneur, and engineer with over a decade of experience in taking cutting edge AI research from ideation stage to scalable products, across different industry verticals.  He has lead teams at global companies like Microsoft and IBM Research / IBM Japan, along with national research labs like RIKEN Japan and the Max Planck Institute Germany. Previously, he helped establish and lead the technology division at lean startups in Japan and Singapore, in semiconductor technology, robotics and Fintech sectors. Sakya is the inventor of over 20 patents and has published widely on machine learning and AI with over 1,000 citations. 

Sakya holds a PhD. in Physics of Complex Systems from the Max Planck Institute in Germany, along with Masters in Artificial Intelligence from The University of Edinburgh and a Bachelors of Computer Engineering. Prior to founding EdgeCortix he completed his entrepreneurship studies from the MIT Sloan School of Management.

Sakyasingha Dasgupta

Founder & CEO
EdgeCortix

Sakya is the founder and Chief Executive officer of EdgeCortix. He is an artificial intelligence (AI) and machine learning technologist, entrepreneur, and engineer with over a decade of experience in taking cutting edge AI research from ideation stage to scalable products, across different industry verticals.  He has lead teams at global companies like Microsoft and IBM Research / IBM Japan, along with national research labs like RIKEN Japan and the Max Planck Institute Germany. Previously, he helped establish and lead the technology division at lean startups in Japan and Singapore, in semiconductor technology, robotics and Fintech sectors. Sakya is the inventor of over 20 patents and has published widely on machine learning and AI with over 1,000 citations. 

Sakya holds a PhD. in Physics of Complex Systems from the Max Planck Institute in Germany, along with Masters in Artificial Intelligence from The University of Edinburgh and a Bachelors of Computer Engineering. Prior to founding EdgeCortix he completed his entrepreneurship studies from the MIT Sloan School of Management.

Author:

Sailesh Chittipeddi

EVP, GM & President, Renesas USA
Renesas

Dr. Sailesh Chittipeddi became the Executive Vice President and the General Manager of the Embedded Processing, Digital Power and Signal Chain Solutions Group of Renesas in July 2019. He joined Renesas in March 2019.

Before joining Renesas, he served as IDT’s Executive Vice President of Global Operations and CTO, with an additional focus on corporate growth and differentiation. In this role, he was responsible for the company’s operations, procurement, quality, supply chain, foundry engineering, assembly engineering, product & test engineering, facilities, Design Automation, and Information Technology groups. From a product line perspective, he had responsibility for the IoT Systems Group, RapidWave Interconnect Systems, PCIe and Standard Products Group. Additionally, Dr. Chittipeddi helped IDT leverage its existing strengths to increase corporate value while driving the rapid delivery of new products.

Prior to joining IDT, Dr. Chittipeddi was President and CEO of Conexant Systems and served on its Board of Directors. He led the company in its transition from a public company to private ownership and through its debt restructuring efforts. Before that, he held several executive roles at Conexant Systems, including COO, co-President, EVP for Operations and Chief Technical Officer, with responsibility for global engineering, product development, operations, quality, facilities, IT and associated infrastructure support. Dr. Chittipeddi started his career in technology with AT&T Bell Labs and progressively managed larger engineering and operations groups with AT&T Microelectronics/Lucent and Agere Systems. Dr. Chittipeddi serves on the Board of Directors for Avalanche Technology (USA) and Tessolve (Division of Hero Electronix, India). He also serves as a Board Observer in Blu Wireless Technology (Bristol, UK), Peraso Technologies (Canada) and Anagog (Israel).

Dr. Chittipeddi holds five degrees, including an MBA from the University of Texas at Austin and a Ph.D. in physics from The Ohio State University. Dr. Chittipeddi has earned 64 U.S. patents related to semiconductor process, package and design, and has had nearly 40 technical articles published.

Sailesh Chittipeddi

EVP, GM & President, Renesas USA
Renesas

Dr. Sailesh Chittipeddi became the Executive Vice President and the General Manager of the Embedded Processing, Digital Power and Signal Chain Solutions Group of Renesas in July 2019. He joined Renesas in March 2019.

Before joining Renesas, he served as IDT’s Executive Vice President of Global Operations and CTO, with an additional focus on corporate growth and differentiation. In this role, he was responsible for the company’s operations, procurement, quality, supply chain, foundry engineering, assembly engineering, product & test engineering, facilities, Design Automation, and Information Technology groups. From a product line perspective, he had responsibility for the IoT Systems Group, RapidWave Interconnect Systems, PCIe and Standard Products Group. Additionally, Dr. Chittipeddi helped IDT leverage its existing strengths to increase corporate value while driving the rapid delivery of new products.

Prior to joining IDT, Dr. Chittipeddi was President and CEO of Conexant Systems and served on its Board of Directors. He led the company in its transition from a public company to private ownership and through its debt restructuring efforts. Before that, he held several executive roles at Conexant Systems, including COO, co-President, EVP for Operations and Chief Technical Officer, with responsibility for global engineering, product development, operations, quality, facilities, IT and associated infrastructure support. Dr. Chittipeddi started his career in technology with AT&T Bell Labs and progressively managed larger engineering and operations groups with AT&T Microelectronics/Lucent and Agere Systems. Dr. Chittipeddi serves on the Board of Directors for Avalanche Technology (USA) and Tessolve (Division of Hero Electronix, India). He also serves as a Board Observer in Blu Wireless Technology (Bristol, UK), Peraso Technologies (Canada) and Anagog (Israel).

Dr. Chittipeddi holds five degrees, including an MBA from the University of Texas at Austin and a Ph.D. in physics from The Ohio State University. Dr. Chittipeddi has earned 64 U.S. patents related to semiconductor process, package and design, and has had nearly 40 technical articles published.