AI Hardware Summit 2021 | Kisaco Research

THE INDUSTRY EVENT FOR THE AI HARDWARE ECOSYSTEM

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Mountain View, CA
14-16 September, 2021

“The AI Hardware Summit is a great place where lots of people interested in AI Hardware are coming together and exchanging ideas, and together we make the technology better. There’s a synergistic effect at these summits which is really amazing and powers the entire industry.”

John L. Hennessy, Chairman, Alphabet
700+
Attendees
60+
Leading Speakers

Why Attend

  • Luminary Keynotes: In 2020 we saw unique perspectives from industry luminaries such as Turing Award Winner David Patterson, and venture capital pathfinder and computer hardware industry veteran, Vinod Khosla. Returning 2019 AIHW Summit luminary Lip-Bu Tan, CEO of Cadence Design Systems.
  • Innovations and Optimizations of Silicon & Systems for AI Training & Inference: Product launches & deep-dives from C-level executives in the AI Hardware industry.
  • Optimizing Machine Learning Systems: Hyperscaler perspectives on designing & engineering bleeding-edge AI systems, from hardware through software. ML system co-design and protecting compute performance gains by eliminating system-level inefficiencies.
  • Inference in Client (Edge) Computing: Applications for AI accelerators in cameras, consumer electronics, autonomous vehicles etc.
  • Preserving Developer Efficiency in the Adoption of Novel AI Hardware
  • Beyond Compute: AI’s Impact on memory, storage & networking: Innovations in HBM, on-chip memory and NVM, I/O bottlenecks, data transfer & high-speed interconnects.
  • Managing Machine Learning Models at Scale: Machine Learning hardware robustness & reprogrammability, model standardization & interoperability.
  • Financial & Industrial Analysis: New in 2020: Presentation of the results and insights from AI Hardware Summit’s first comprehensive vendor comparison report, detailing 20 vendors. VC investment and broader market trends & dynamics, benchmarking & metrics.

2021 Advisory Board

Author:

Andrew Feldman

Co-Founder & CEO
Cerebras Systems

Andrew is a co-founder and CEO of Cerebras Systems, a venture-backed stealth-mode startup located in Los Altos, California. He leads a team of phenomenal people with a track record of building products that profoundly changed the largest markets in tech.
Prior to co-founding Cerebras Systems, he was co-founder and CEO of SeaMicro. SeaMicro (acquired by AMD for $355 million) was the pioneer in low power server technology. SeaMicro changed the trajectory of the server industry by inventing the high density, lower power, microserver category.
Prior to co-founding SeaMicro, he was Vice President of Marketing and Product Management at Force10 (acquired by Dell for $800 Million) Networks, and Vice President of Corporate Marketing and Corporate Development for Riverstone Networks (NASDAQ: RSTN) from inception through IPO.
Andrew holds a B.A. and MBA from Stanford University.

Author:

Lip-Bu Tan

CEO
Cadence Design Systems

Lip-Bu Tan has served as CEO of Cadence Design Systems, Inc. since January 2009 and has been a member of the Cadence Board of Directors since February 2004. He served as President of the company from 2009 to 2017. He also serves as chairman of Walden International, a venture capital firm he founded in 1987. Prior to founding Walden, Tan was Vice President at Chappell & Co. and held management positions at EDS Nuclear and ECHO Energy.

 

He is a member of The Business Council, is Chairman of the Board of SambaNova Systems, Inc, and serves on the board of directors of Hewlett Packard Enterprise Co., Schneider Electric, and Green Hills Software, as well as on the boards of the Electronic System Design Alliance (ESD Alliance) and the Global Semiconductor Association (GSA). He also serves on the Board of Trustees and the School of Engineering Dean’s Council at Carnegie Mellon University (CMU). Tan was the recipient of the 2016 GSA Morris Chang Exemplary Leadership Award.

 

Tan received a BS from Nanyang University in Singapore, an MS in nuclear engineering from the Massachusetts Institute of Technology, and an MBA from the University of San Francisco.

Author:

Rashmi Gopinath

General Partner
B Capital Group

Author:

Karl Freund

Senior Analyst, Machine Learning & HPC
Moor Insights & Strategy

Karl Freund is Moor Insights & Strategy’s consulting lead for HPC and Deep Learning. His recent experiences as the VP of Marketing at AMD and Calxeda, as well as his previous positions at Cray and IBM, positions him as a leading industry expert in these rapidly evolving industries. Karl works with investment and technology customers to help them understand the emerging Deep Learning opportunity in data centers, from competitive landscape to ecosystem to strategy.

Karl has worked directly with datacenter end users, OEMs, ODMs and the industry ecosystem, enabling him to help his clients define the appropriate business, product, and go-to-market strategies. He is also recognized expert on the subject of low-power servers and the emergence of ARM in the datacenter and has been a featured speaker at scores of investment and industry conferences on this topic.

Accomplishments during his career include:

  • Led the revived HPC initiative at AMD, targeting APUs at deep learning and other HPC workloads
  • Created an industry-wide thought leadership position for Calxeda in the ARM Server market
  • Helped forge the early relationship between HP and Calxeda leading to the surprise announcement of HP Moonshot with Calxeda in 2011
  • Built the IBM Power Server brand from 14% market share to over 50% share
  • Integrated the Tivoli brand into the IBM company’s branding and marketing organization
  • Co-Led the integration of HP and Apollo Marketing after the Boston-based desktop company’s acquisition

Karl’s background includes RISC and Mainframe servers, as well as HPC (Supercomputing). He has extensive experience as a global marketing executive at IBM where he was VP Marketing (2000-2010), Cray where he was VP Marketing (1995-1998), and HP where he was a Division Marketing Manager (1979-1995).

 

Author:

Yvonne Lutsch

Investment Principal
Bosch Ventures

Author:

Kunle Olukotun

Co-founder and Chief Technologist
SambaNova Systems

Kunle Olukotun is Cadence Design Professor of Electrical Engineering and Computer Science at Stanford University. He founded Afara Websystems, acquired by Sun in 2002. He is a Pioneer of Chip Multiprocessor Designs, Director of the Stanford Pervasive Parallelism Lab, and Co-leader of the Data Analytics for What’s Next (DAWN) research program.

In 2017 Olukotun and Chris Ré founded SambaNova Systems. SambaNova Systems has developed a disruptive next-generation computing platform to power machine learning and data analytics.

Author:

Cliff Young

Software Engineer
Google Brain

Author:

Marc Tremblay

Distinguished Engineer
Microsoft

Author:

Victoria Rege

Director of Alliances & Strategic Partnerships
Graphcore

Victoria has over a decade of experience in the semiconductor space. She currently heads up Strategic Partnerships at Graphcore, working with key customers and leading Research & Universities AI engagements. Previously she held several leadership positions at NVIDIA from global alliances, product marketing and campaigns to the founding of the GPU Technology Conference. Prior to joining NVIDIA, Victoria worked in the hedge fund space, as Executive Director for the Hedge Fund Business Operations Association. Victoria is a frequent contributor to ACM SIGGRAPH and is Immersive Chair for the SIGGRAPH 2019 Conference. She's also an active member of the Consumer Technology Association's AI Working Group.

Author:

Cheng Wang

Co-Founder & SVP, Architecture & Engineering
Flex Logix

CHENG WANG. Senior VP Engineering: Architecture, Software, Silicon. Originally from Shanghai, PRC. BSEECS, UC Berkeley. Cheng has led the architecture, silicon implementation and software development for eFPGA over two generations from 180nm-16nm and now neural inferencing. Two years as VLSI designer at Zoran. MSEE, EE PhD UCLA: designed 5 FPGA chips from 90nm to 40nm. 2013 Distinguished PhD Dissertation Award. 2014 ISSCC Lewis Winner Award for Outstanding Paper. Multiple patents at UCLA and Flex Logix.

Flex Logix’s NMAX platform excels at getting high hardware utilization at batch=1, which is critical for edge applications. Most of the new information is in the 2nd half of the slide deck.

NMAX delivers from 1 to 100+TOPS, as you need, at 10x lower cost and 3-5x lower power than existing solutions because we get 50-80% MAC utilization on tough models, meaning we need less silicon area, and we achieve it with 10x less DRAM bandwidth, meaning less DRAM cost and system power.

Author:

Rick Merritt

Staff Writer
NVIDIA

Author:

Jimmy Pike

SVP & Senior Fellow, Servers and Infrastructure Systems
Dell EMC

Jimmy D. Pike is a Senior Vice President and Senior Fellow at Dell EMC and serves as a senior system architect and technologist in the office of Dell’s Server and Infrastructure System’s CTO. In addition to his duties as an “at large” technologist, he focuses on high-performance computing, machine learning, and edge computing.

A longtime industry figure with more than 50 patents, Jimmy has served in various executive and technology roles:
• An analyst at the analyst firm of Moor Insights & Strategy
• Chief Architect of Dell’s Enterprise Solutions group and HPC lead technologist
• Chief Architect and Technologist for Dell’s Data Center group.

Jimmy has as also served in various other leadership roles at Intel, AT&T, NCR, and Harris Corporation.

Author:

Sailesh Kottapalli

Senior Fellow, Chief Architect, Datacenter Processor Architecture
Intel

Sailesh Kottapalli is an Intel Senior Fellow and the chief architect of data center processor architecture in the Silicon Engineering Group. He leads a team of architects responsible for developing the architecture of Intel® Xeon® and Intel® Atom™ server product lines as well as the overall compute solutions strategy for datacenter segment. He also leads a cross-organizations effort in driving the technology leadership on the Interconnect pillar. Kottapalli joined Intel in 1996 as a design engineer working on the first Intel® Itanium® processor, then code-named “Merced.” Subsequently, he served as lead engineer for several Intel Itanium and Intel Xeon processor evaluations, and more recently, as lead architect for a series of Intel Xeon server processors. His work in this area earned Kottapalli an Intel Achievement Award for delivering record generational performance improvements in a high-end server product. An active participant in industry and internal conferences, Kottapalli has authored or co-authored several published technical papers, delivered talks and taken part in roundtables and panel discussions. He has also been granted approximately three dozen patents in processor architecture, with additional patents pending. Kottapalli holds a bachelor’s degree in computer science from Andhra University in India and a master’s degree in computer engineering from Virginia Tech.

AUDIENCE BREAKDOWN

AI Hardware Summit Audience Breakdown

Past attendees include: 

2021 Partners

Gold Partner

Event Partner

Past Partners

2021 Prospectus

Please complete your details to receive a copy of the 2021 sponsorship prospectus. 

Watch video highligts from the AI Hardware Summit 2019: 

Download Prospectus

Become a Sponsor

Kisaco Research provides the much-needed platform on which industry executives can network, connect and learn from each other as well as meet potential industry partners.

Far from the typical ‘meet-and-greet’ exhibition experience, you – as a sponsor or exhibitor – will be positioned as a partner of the event with a focus on the benefits of your product and brand, rather than just a name on an exhibition list.

With our extensive marketing experience and strategy, your partnership with Kisaco Research will grant you a sponsorship package that is an extension and enhancement of your current marketing and branding efforts. We value your ROI and will work with you directly on your specific goals and targets – that’s why we take special care in finding the most relevant end-users to attend, so that your financial and resource investment is smartly allocated.

Find out more by calling us at +44 (0)20 3696 2920 or email us at [email protected].

Interested in a media partner pass?

If you regularly cover the AI chip industry and want to stay at the cusp of innovation and hear the latest product and company launches, get in touch. We want to work with you!

Contact: Stephanie Wright, Head of Marketing
[email protected] 

Highlights

 

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TESTIMONIALS

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